Electronic Design Automation Tools (EDA) Market: By Product (Computer Aided Engineering (CAE), IC Physical Design & Verification, Printed Circuit Board (PCB) and Multi-Chip Module (MCM), Semiconductor Intellectual Property (SIP)), Deployment Mode (On-premises, Cloud-based) By Application (Aerospace & Defense, Automotive, Consumer Electronics, Industrial, Medical, Telecommunications) and Geography  

Electronic Design Automation Tools (EDA) Market Size is expected to be valued at USD 11.2 bn in 2022 and is expected to grow at 9.8% CAGR over the forecast period 2023-2029. Rising Penetration of IoT, Artificial Intelligence and virtual Reality act as the drivers towards the global market. There are few restrains such as high cost; work is complex in nature which require high accuracy and skilled labors. The increasing demand for advanced electronic devices will provide multiple opportunities to the global electronic design automation tools (EDA) market. The report studies global market dynamics elaborately to identify the current trends & drivers, future opportunities and possible challenges to the key stakeholders operating in the market. In addition, global electronic design automation tools (EDA) market report includes human demographics; regulatory scenario, and competition analysis with vividly illustrated the competition dashboard to assess the market competition. Moreover, PBI analyzed the market to better equip clients with possible investment opportunities across the regions (regional Investment Hot-Spots) and market unmet needs (Product Opportunities). Key stakeholders of the global market report include suppliers, manufacturers, marketers, policy makers, and service providers engaged in global electronic design automation tools (EDA) market.

Key Developments: In May 2019 - Cadence Design Systems Inc expanded its Verification Suite and System Innovation offerings with the launch of the Cadence Protium X1 Enterprise Prototyping Platform. The platform is applicable to multi-billion-gate AI and 5G chips to single-FPGA IoT chips and IP blocks. It can also help customers achieving up to 80% faster bring-up, with a scalable capacity of up to 32 racks, and up to 24X more capacity than competing desktop prototyping systems. In January 2019 - Ansys entered into a definitive agreement to acquire Helic, one of the industry-leading provider of electromagnetic crosstalk solutions for systems on chips (SoCs). The acquisition of Helic, combined with ANSYS flagship electromagnetic and semiconductor solvers, will offer a comprehensive solution for on-chip, 3D integrated circuit, and chip-package-system electromagnetics and noise analysis.