- In-line SPI System
- Off-line SPI System
Solder Paste Inspection (SPI) System Market size was valued at USD 608.3 billion in 2021 and is expected to reach USD 951.5 billion by 2028, at a CAGR of 6.6% during the forecast period 2022 to 2028. It has been estimated with a significant growth with the help of key drivers which include rapid growth in automotive and consumer electronics. Thereâ€™s a restrain which may hamper the growth of global solder paste inspection (SPI) system market is the high cost and limitation of trained laborer. Aerospace and medical fields will play more and more role in future hence contributing significant opportunity which would help in the sustain growth of global solder paste inspection (SPI) market. The report studies global solder paste inspection (SPI) system market dynamics elaborately to identify the current trends & drivers, future opportunities and possible challenges to the key stakeholders operating in the market. In addition, market report includes human demographics; regulatory scenario, and competition analysis with vividly illustrated the competition dashboard to assess the market competition. Moreover, PBI analyzed global market to better equip clients with possible investment opportunities across the regions (regional Investment Hot-Spots) and market unmet needs (Product Opportunities).
Fastest Growing Market
It is noticed that the global solder paste inspection market has a significant market growth rate on the perspective of increasing manufacture and test of electronics printed circuit boards. With the marketplace now requiring high volume, high quality products to be brought to market very quickly very reliable and fast methods are needed to ensure that product quality remains high. Solder Paste Inspection is an essential tool that ensure costs are kept as low as possible by detecting faults in the solder printing stage of production line. They are able to detect a variety of defects such as nodules, scratches and stains as well as the more familiar dimensional defects such as volume, area, height, shape, Bridge, Overflow etc. which boost the global market.
2021 is the base year and 2028 is the forecast year.
The report covers the five regions and 15+ countries market data: North America (United States, Canada), Europe (Germany, France, Italy, Spain, and United Kingdom (UK), Asia Pacific (China, India, Japan, Australia & New Zealand), Latin America (Brazil, Mexico, Argentina) and Middle East and Africa (Saudi Arabia, United Arab Emirates, South Africa).
In our report, we provide 12-15 market players’ information into the report. However, based on the client’s request we will provide additional country and regional market players information as well.
Key playerâ€™s profiles in the global solder paste inspection (SPI) market include: