Solder Paste Inspection System Market By Type By Application By Product and Region Forecast 2020-2031

Solder Paste Inspection (SPI) System Market Size, Share, Growth, Trends, and Global Industry Analysis: By Type (In-line SPI System, Off-line SPI System) By Application (Automotive Electronics, Consumer Electronics,  Industrials, Others) By Product (E3000-X 3D SPI, SE600-X 3D SPI, SE500-X 3D, Others) and Region Forecast 2020-2031

Solder Paste Inspection (SPI) System Market size was valued at US$ 489.7 million in 2024 and is expected to reach US$ 766.0 million by 2031, growing at a significant CAGR of 6.6% from 2025-2031. It has been estimated with a significant growth with the help of key drivers which include rapid growth in automotive and consumer electronics. There's a restrain which may hamper the growth of the system market the high cost and the limitation of trained laborers. Aerospace and medical fields will play more and more role in the future hence contributing significant opportunities that would help in the sustained growth of the market. The report studies market dynamics elaborately to identify the current trends & drivers, future opportunities, and possible challenges to the key stakeholders operating in the market.  

Key Developments

  • In Jan 2018, Yamaha Motor Co., Ltd. announced the release of the YSi-SP, a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our 1-head solution concept for using a single type of head to handle various inspection.
  • In May 2016, ASC will add to its range of solutions in capacitive sensors by now manufacturing piezoelectric accelerometers. The new products are perfect for condition and structural health monitoring in mass industrial applications.

Solder Paste Inspection Spi System Market Summary

Study Period

2025-2031

Base Year

2024

CAGR

6.6%

Largest Market

North-America

Fastest Growing Market

Asia-Pacific

Solder Paste Inspection (SPI) System Market Dynamics

It is noticed that the market has a significant market growth rate on the perspective of increasing manufacture and test of electronics printed circuit boards. With the marketplace now requiring high volume, high quality products to be brought to market very quickly very reliable and fast methods are needed to ensure that product quality remains high. Solder Paste Inspection is an essential tool that ensure costs are kept as low as possible by detecting faults in the solder printing stage of production line. They are able to detect a variety of defects such as nodules, scratches and stains as well as the more familiar dimensional defects such as volume, area, height, shape, Bridge, Overflow etc. which boost the global market.

Solder Paste Inspection Spi System Market Segmentation Analysis

Report Benchmarks

Details

Report Study Period

2025-2031

Market Size in 2024

US$ 489.7 million

Market Size in 2031

US$ 766.0 million

Market CAGR

6.6%

By Type

  • In-line SPI System
  • Off-line SPI System

By Application

  • Automotive Electronics
  • Consumer Electronics
  • Industrials
  • Others

By Product Type

  • E3000-X 3D SPI
  • SE600-X 3D SPI
  • SE500-X 3D SPI
  • Others

By Region

  • North America (U.S., Canada)
  • Europe (Germany, U.K., France, Italy, Russia, Spain, Rest of Europe)
  • Asia-Pacific (China, India, Japan, Australia, Southeast Asia, Rest of Asia Pacific)
  • Latin America (Mexico, Brazil, Argentina, Columbia, Rest of Latin America)
  • Middle East & Africa (GCC, Egypt, Nigeria, South Africa, Rest of Middle East and Africa)

Key Features of the Report

  • The solder paste inspection system market report provides granular level information about the market size, regional market share, historic market (2020-2024), and forecast (2025-2031)
  • The report covers in-detail insights about the competitor’s overview, company share analysis, key market developments, and their key strategies
  • The report outlines drivers, restraints, unmet needs, and trends that are currently affecting the market
  • The report tracks recent innovations, key developments, and start-up details that are actively working in the market
  • The report provides a plethora of information about market entry strategies, regulatory framework, and reimbursement scenario
  • The report analyses the impact of socio-political environment through PESTLE Analysis and competition through Porter's Five Force Analysis

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Frequently Asked Questions

Solder paste inspection system market size was valued at US$ 489.7 million in 2024 and is expected to reach US$ 766.0 million by 2031, growing at a significant CAGR of 6.6% from 2025-2031.

The market report covers the five regions and 15+ countries market data: North America (United States, Canada), Europe (Germany, France, Italy, Spain, and United Kingdom (UK), Asia Pacific (China, India, Japan, Australia & New Zealand), Latin America (Brazil, Mexico, Argentina) and Middle East and Africa (Saudi Arabia, United Arab Emirates, South Africa).

The solder paste inspection system market key players are ASC International (US), Jet Technology (Taiwan), Pemtron (Korea), Sinic-Tek Vision Technology (China), Caltex Scientific (US), SAKI Corporation (Japan), Machine Vision Products (MVP) (US)

1.Executive Summary
2.Global Solder Paste Inspection Spi System Market Introduction 
2.1.Global Solder Paste Inspection Spi System Market  - Taxonomy
2.2.Global Solder Paste Inspection Spi System Market  - Definitions
2.2.1.Type
2.2.2.Application
2.2.3.Product Type
2.2.4.Region
3.Global Solder Paste Inspection Spi System Market Dynamics
3.1. Drivers
3.2. Restraints
3.3. Opportunities/Unmet Needs of the Market
3.4. Trends
3.5. Product Landscape
3.6. New Product Launches
3.7. Impact of COVID 19 on Market
4.Global Solder Paste Inspection Spi System Market Analysis, 2020 - 2024 and Forecast 2025 - 2031
4.1.  Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
4.2.  Year-Over-Year (Y-o-Y) Growth Analysis (%) 
4.3.  Market Opportunity Analysis 
5.Global Solder Paste Inspection Spi System Market  By Type, 2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
5.1. In-line SPI System
5.1.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
5.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
5.1.3. Market Opportunity Analysis 
5.2. Off-line SPI System
5.2.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
5.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
5.2.3. Market Opportunity Analysis 
6.Global Solder Paste Inspection Spi System Market  By Application, 2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
6.1. Automotive Electronics
6.1.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
6.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
6.1.3. Market Opportunity Analysis 
6.2. Consumer Electronics
6.2.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
6.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
6.2.3. Market Opportunity Analysis 
6.3. Industrials
6.3.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
6.3.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
6.3.3. Market Opportunity Analysis 
6.4. Others
6.4.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
6.4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
6.4.3. Market Opportunity Analysis 
7.Global Solder Paste Inspection Spi System Market  By Product Type, 2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
7.1. E3000-X 3D SPI
7.1.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
7.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
7.1.3. Market Opportunity Analysis 
7.2. SE600-X 3D SPI
7.2.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
7.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
7.2.3. Market Opportunity Analysis 
7.3. SE500-X 3D SPI
7.3.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
7.3.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
7.3.3. Market Opportunity Analysis 
7.4. Others
7.4.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
7.4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
7.4.3. Market Opportunity Analysis 
8.Global Solder Paste Inspection Spi System Market  By Region, 2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
8.1. North America
8.1.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
8.1.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
8.1.3. Market Opportunity Analysis 
8.2. Europe
8.2.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
8.2.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
8.2.3. Market Opportunity Analysis 
8.3. Asia Pacific (APAC)
8.3.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
8.3.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
8.3.3. Market Opportunity Analysis 
8.4. Middle East and Africa (MEA)
8.4.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
8.4.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
8.4.3. Market Opportunity Analysis 
8.5. Latin America
8.5.1. Market Analysis, 2020 - 2024 and Forecast, 2025 - 2031, (Sales Value USD Million)
8.5.2. Year-Over-Year (Y-o-Y) Growth Analysis (%) and Market Share Analysis (%) 
8.5.3. Market Opportunity Analysis 
9.North America Solder Paste Inspection Spi System Market ,2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
9.1. Type Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
9.1.1.In-line SPI System
9.1.2.Off-line SPI System
9.2.  Application Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
9.2.1.Automotive Electronics
9.2.2.Consumer Electronics
9.2.3.Industrials
9.2.4.Others
9.3.  Product Type Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
9.3.1.E3000-X 3D SPI
9.3.2.SE600-X 3D SPI
9.3.3.SE500-X 3D SPI
9.3.4.Others
9.4.  Country Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
9.4.1.United States of America (USA)
9.4.2.Canada
10.Europe Solder Paste Inspection Spi System Market ,2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
10.1. Type Analysis  and Forecast  by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
10.1.1.In-line SPI System
10.1.2.Off-line SPI System
10.2.  Application Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
10.2.1.Automotive Electronics
10.2.2.Consumer Electronics
10.2.3.Industrials
10.2.4.Others
10.3.  Product Type Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
10.3.1.E3000-X 3D SPI
10.3.2.SE600-X 3D SPI
10.3.3.SE500-X 3D SPI
10.3.4.Others
10.4.  Country Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
10.4.1.Germany
10.4.2.France
10.4.3.Italy
10.4.4.United Kingdom (UK)
10.4.5.Spain
11.Asia Pacific (APAC) Solder Paste Inspection Spi System Market ,2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
11.1. Type Analysis  and Forecast  by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
11.1.1.In-line SPI System
11.1.2.Off-line SPI System
11.2.  Application Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
11.2.1.Automotive Electronics
11.2.2.Consumer Electronics
11.2.3.Industrials
11.2.4.Others
11.3.  Product Type Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
11.3.1.E3000-X 3D SPI
11.3.2.SE600-X 3D SPI
11.3.3.SE500-X 3D SPI
11.3.4.Others
11.4.  Country Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
11.4.1.China
11.4.2.India
11.4.3.Australia and New Zealand (ANZ)
11.4.4.Japan
11.4.5.Rest of APAC
12.Middle East and Africa (MEA) Solder Paste Inspection Spi System Market ,2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
12.1. Type Analysis  and Forecast  by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
12.1.1.In-line SPI System
12.1.2.Off-line SPI System
12.2.  Application Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
12.2.1.Automotive Electronics
12.2.2.Consumer Electronics
12.2.3.Industrials
12.2.4.Others
12.3.  Product Type Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
12.3.1.E3000-X 3D SPI
12.3.2.SE600-X 3D SPI
12.3.3.SE500-X 3D SPI
12.3.4.Others
12.4.  Country Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
12.4.1.GCC Countries
12.4.2.South Africa
12.4.3.Rest of MEA
13.Latin America Solder Paste Inspection Spi System Market ,2020 - 2024 and Forecast 2025 - 2031 (Sales Value USD Million)
13.1. Type Analysis  and Forecast  by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
13.1.1.In-line SPI System
13.1.2.Off-line SPI System
13.2.  Application Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
13.2.1.Automotive Electronics
13.2.2.Consumer Electronics
13.2.3.Industrials
13.2.4.Others
13.3.  Product Type Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
13.3.1.E3000-X 3D SPI
13.3.2.SE600-X 3D SPI
13.3.3.SE500-X 3D SPI
13.3.4.Others
13.4.  Country Analysis 2020 - 2024 and Forecast 2025 - 2031 by Sales Value USD Million, Y-o-Y Growth (%), and Market Share (%) 
13.4.1.Brazil
13.4.2.Mexico
13.4.3.Rest of LA
14. Competition Landscape
14.1.  Market Player Profiles (Introduction, Brand/Product Sales, Financial Analysis, Product Offerings, Key Developments, Collaborations, M & A, Strategies, and SWOT Analysis) 
14.2.1.Koh Young (Korea)
14.2.2.Vi TECHNOLOGY (France)
14.2.3.MirTec Ltd (Korea)
14.2.4.ViTrox (Malaysia)
14.2.5.Test Research, Inc (TRI) (Taiwan)
14.2.6.CKD Corporation (Japan)
14.2.7.Viscom AG (Germany)
14.2.8.PARMI Corp (Korea)
14.2.9.Mek (Marantz Electronics) (Japan)
14.2.10.ASC International (US)
14.2.11.Jet Technology (Taiwan), Pemtron (Korea)
14.2.12.Sinic-Tek Vision Technology (China)
14.2.13.Caltex Scientific (US)
14.2.14.SAKI Corporation (Japan)
14.2.15.Machine Vision Products (MVP) (US)
15. Research Methodology 
16. Appendix and Abbreviations 

Key Market Players

  • Koh Young (Korea)
  • Vi TECHNOLOGY (France)
  • MirTec Ltd (Korea)
  • ViTrox (Malaysia)
  • Test Research, Inc (TRI) (Taiwan)
  • CKD Corporation (Japan)
  • Viscom AG (Germany)
  • PARMI Corp (Korea)
  • Mek (Marantz Electronics) (Japan)
  • ASC International (US)
  • Jet Technology (Taiwan), Pemtron (Korea)
  • Sinic-Tek Vision Technology (China)
  • Caltex Scientific (US)
  • SAKI Corporation (Japan)
  • Machine Vision Products (MVP) (US)

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