Wafer Level Packaging Market: By Product (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others), By Application (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, and Others), By Technology (Flip Chip, Compliant WLP, Conventional Chip Scale Package, Wafer Level Chip Scale Package, Nano Wafer Level Packaging, 3D Wafer Level Packaging), and Geography

Wafer Level Packaging Market size was valued at USD 4,893.6 million in 2022, growing at a 19.3% CAGR from 2023 to 2029. Wafer level packaging is the technology used in interconnecting the electronic components like capacitor, transistors, resistors, and others in a single chip in order to make an integrated circuit.The wafer level packaging has multiple chip capacity, improves mechanical and electrical performance, and outstands cost and performance capability. In increasing need and demand for high speed and compact size electronic product is expected to drive the growth of wafer level packaging market in the forecasted years. In addition, the growing popularity of Internet of Things and portable electronics is expected to fuel the market growth. The advanced technological packaging technique and increasing need of circuit miniaturization in microelectronic devices is expected to boost the growth of wafer level packaging in the forecasted years. High cost of initial investments and encapsulation process is expected to hinder the market growth in the forecasted years. The wafer level packaging is growing at a high rate in semiconductor packaging industry due to the increasing demand of lighter, faster, smaller and cheap electronic products with low packaging cost and high performance. The rapid advancement in integrated circuit fabrication is expected to aid the use of wafer level packaging in the semiconductor industry. However, solder joint thermal cycling reliability of standard wafer level packaging is expected to hinder the market growth in the forecasted years.The increase in demand and sale of smartphones and tablets in Asia Pacific region is expected to drive the growth of market in this region.  

Wafer Level Packaging Market Developments:

• In August 2021, ACM Research launched its first plating tool ‘Ultra ECP GIII plating tool’ to support wafer level packaging for compound semiconductors.